Search results

This work aims to present a guideline for ink development used in extrusion-based direct-write (DW) (also referred to as direct-print [DP]) technique and combine the extrusion with instant photopolymerization to present a solvent-free DP photopolymerization (DPP) method to fill the gap between 3D printing and printing multi-functional 3D structures.

A DP process called DPP was developed by integration of a screw-driven micro-dispenser into XYZ translation stages. The process was equipped with direct photopolymerization to facilitate the creation of 3D structures. The required characteristics of inks used in this technique were simulated through dispersion of fumed silica particles into photocurable resins to transform them into viscoelastic inks. The characterization method of these inks and the required level of shear thinning and thixotropic properties is presented.

Shear thinning and thixotropic properties are necessary components of the inks used in DPP process and other DP techniques. These properties are desirable to facilitate printing and filament shape retention. Extrusion of viscoelastic inks out of a nozzle generates a filament capable of retaining its geometry. Likewise, instant photopolymerization of the dispensed filaments prevents deformation due to the weight of filaments or accumulated weight of layers.

The DPP process with material-reforming methods has been shown, where there remain many shortcomings in realizing a DP-based 3D printing process with instant photopolymerization in existing literature, as well as a standard guideline and material requirements. The suggested method can be extended to develop a new commercial 3D printing system and printable inks to create various functional 3D structures including sensors, actuators and electronics, where nanoparticles are involved for their functionalities. Particularly, an original contribution to the determination of a rheological property of an ink is provided.

In stereolithography (SL), the total exposure absorbed by photopolymer is variable and is a function of height. This phenomenon causes heterogeneous properties and develops residual stresses during process. Consequently, a pronounced deformation occurs especially when small and more intricate objects are fabricated. The purpose of this paper is to predict this deformation when miniature and complicated parts are fabricated.

In this paper classical lamination theory is employed to model mechanical properties of layers, layers shrinkage and residual stress growth during SL process. Distortion is predicted based on the developed model.

Results show that final distortion is proportional to part thickness and it increases exponentially as parts thickness or layers thickness decrease.

To verify the results, several test pieces were built with SLA 5000 machine and SOMOS 11120 resins. Their distortions were measured with video measuring machine (VMM‐3020D machine). The estimation agrees very well with the experimental results (less than 10 per cent error).

The paper considers the heterogeneous properties of SL parts during fabrication process; an item which was ignored in previous researches. This theoretical and experimental study provides useful information about estimation of deformation of SL parts after building. This information helps the SL machine user to select the best parameters when fabricating miniature and intricate features, especially for biomechanics parts.

This study aims to propose the increase of heat dissipation requirements of modern electronic equipment and the fast development of micro-scale manufacturing technologies. The heat transfer mechanism is studied in-depth, especially for its pattern of secondary flow caused by the repeated inversion of centrifugal force. Effects of η on the frictional pressure drop and average Nusselt number are studied and the performance of such microchannel heat sink with various bend amplitudes is comprehensively evaluated. These results can provide important insight into the optimal design of this novel design configuration for microelectronics cooling.

A three-dimensional model based on the finite volume approach and SIMPLEC algorithm is performed to test an innovative serpentine microchannel, which behaves differently from conventional serpentine microchannel due to the significant effect of centrifugal force inversion.

The effect of centrifugal force significantly influences the flow and thermal fields which are responsible for the enhancement in heat transfer coefficient. The number, size and intensity of vortices increase with increasing Re, and the vortices are reformed at every change of the geometry in a periodic fashion. The serpentine microchannel studies more effectively at larger bend amplitude. Pressure fluctuations and temperature variation are greater with increasing bend amplitude.

Several techniques have been developed to augment single-phase convective heat transfer in channels. One technique is to use a serpentine channel that enhances the heat transfer due to flow mixing and periodic interruption of thermal boundary layers. This technique has been applied to micro-heat exchangers, thermal regenerators and mini/microreactors.

The optimal design of this novel design configuration for microelectronics cooling can be attained. It will become an effective cooling technology for solving the increasing of heat dissipation requirements of modern electronic equipment.

The flow and heat transfer characteristics are first presented for the circular serpentine microchannel made up of alternate U-bends without interposed straight segments. The present study first examines the effect of such centrifugal force inversion on velocity contour, pressure distribution and temperature distribution. The patterns of secondary flow along the flow passage caused by the repeated inversion of centrifugal force are further studied in depth. The effect of bend amplitude on the flow and heat transfer is explored and the performance of such microchannel heat sink has been comprehensively evaluated.